Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/28/2022
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Application #:
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16903159
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Filing Dt:
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06/16/2020
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Publication #:
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Pub Dt:
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09/23/2021
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Inventors:
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YU-CHUN FAN, YI-CHING CHIU, FANG-JENG LIN, PI-CHENG LAW
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Title:
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METHOD FOR INCREASING EAM BANDWIDTH, COMPONENT STRUCTURE AND MANUFACTURING PROCESS THEREOF USING PLURAL P-I-N WAVEGUIDES SERIALLY CONNECTED BY HIGH-IMPEDANCE TRANSMISSION LINES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.6, HEJIANG RD., JHONGLI DISTRICT |
| TAOYUAN CITY, TAIWAN 32061 |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 8230 BOONE BLVD, SUITE 405 |
| VIENNA, VA 22182 |
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