Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/21/2023
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Application #:
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17262678
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Filing Dt:
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01/22/2021
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Publication #:
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Pub Dt:
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09/30/2021
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Inventors:
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Chuzo Taniguchi, Satoshi Wada
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Title:
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Conductive Circuit-Attached Molded Product and Manufacturing Method for the Same, and Conductive Circuit-Attached Preform and Manufacturing Method for the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3, MIBU HANAI-CHO, NAKAGYO-KU |
| KYOTO-SHI, KYOTO, JAPAN 604-8551 |
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| THORPE NORTH & WESTERN |
| 8180 S. 700 E., SUITE 350 |
| SANDY, UT 84070 |
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