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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/16/2024
Application #:
17216827
Filing Dt:
03/30/2021
Publication #:
Pub Dt:
09/30/2021
Inventors:
CHEN-HSIU LIN, CHENG-YING LEE, MING-SUNG TSAI
Title:
PACKAGE STRUCTURE WITH SUPPORTING FRAME
Assignment: 1
Reel/Frame:
055763/0120Recorded: 03/30/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/29/2021
Exec Dt:
03/29/2021
Exec Dt:
03/29/2021
Assignees:
NO.88, YANGHU ROAD, WUJIN HI-TECH INDUSTRIAL DEVELOPMENT ZONE,
CHANGZHOU CITY, JIANGSU PROVINCE, CHINA
22F., NO. 392, RUEY KUANG ROAD, NEIHU DIST.,
TAIPEI CITY, TAIWAN
Correspondent:
LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE
3057 NUTLEY STREET
SUITE 818
FAIRFAX, VA 22031

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