Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/10/2023
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Application #:
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17150356
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Filing Dt:
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01/15/2021
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Publication #:
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Pub Dt:
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09/30/2021
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Inventors:
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Jia-Lin WEI, Chih-Cheng LIU, Yen-Yu CHEN, Jr-Hung LI, Tze-Liang LEE, Ming-Hui WENG et al
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Title:
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METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN 300 |
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MCDERMOTT WILL & EMERY LLP |
THE MCDERMOTT BUILDING |
500 NORTH CAPITOL STREET, N.W. |
WASHINGTON, DC 20001 |
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09/23/2024 04:39 PM
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