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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
17223876
Filing Dt:
04/06/2021
Publication #:
Pub Dt:
10/07/2021
Inventors:
Yannick Feurprier, Kaushik Kumar, Zsolt Tokei
Title:
FORMING VIAS IN A SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
056278/0682Recorded: 05/18/2021Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/13/2021
Exec Dt:
04/13/2021
Assignee:
3-1 AKASAKA 5-CHOME
MINATO-KU
TOKYO, JAPAN 107-6325
Correspondent:
SLATER MATSIL, LLP
17950 PRESTON RD
SUITE 1000
DALLAS, TX 75252
Assignment: 2
Reel/Frame:
056278/0802Recorded: 05/18/2021Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/19/2021
Assignee:
KAPELDREEF 75
LEUVEN, BELGIUM 3001
Correspondent:
SLATER MATSIL, LLP
17950 PRESTON RD
SUITE 1000
DALLAS, TX 75252

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