Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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11/29/2022
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Application #:
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16941701
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Filing Dt:
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07/29/2020
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Publication #:
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Pub Dt:
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10/07/2021
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Inventors:
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Huo Yun Duan, Chen Xiong, Lin Zhang, Xi Lin Li, Xiao Lin Kang
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Title:
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COPPER WIRE BOND ON GOLD BUMP ON SEMICONDUCTOR DIE BOND PAD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12500 TI BOULEVARD |
| MS 3999 |
| DALLAS, TEXAS 75243 |
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| TEXAS INSTRUMENTS INCORPORATED |
| P O BOX 655474, MS 3999 |
| DALLAS, TX 75265 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE THE CONVEYING PARTY DATA PREVIOUSLY RECORDED AT REEL: 053339 FRAME: 0149. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 12500 TI BOULVEARD |
| DALLAS, TEXAS 75243 |
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| TEXAS INSTRUMENTS INCORPORATED |
| P O BOX 655474, MS 3999 |
| DALLAS, TX 75265 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY PREVIOUSLY RECORDED ON REEL 053339 FRAME 0149. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 12500 TI BOULVEARD |
| DALLAS, TEXAS 75243 |
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| TEXAS INSTRUMENTS INCORPORATED |
| P O BOX 655474, MS 3999 |
| DALLAS, TX 75265 |
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06/21/2024 08:33 AM
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