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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/23/2024
Application #:
17210843
Filing Dt:
03/24/2021
Publication #:
Pub Dt:
10/07/2021
Inventors:
Katie Lutker-Lee, Dina Triyoso, Angelique Raley
Title:
In-situ Encapsulation of Metal-Insulator-Metal (MIM) stacks for Resistive Random Access Memory (RERAM) Cells
Assignment: 1
Reel/Frame:
055701/0768Recorded: 03/24/2021Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/23/2021
Exec Dt:
03/23/2021
Exec Dt:
03/23/2021
Assignee:
AKASAKA BIZ TOWER
3-1 AKASAKA 5-CHOME, MINATO-KU
TOKYO, JAPAN 107-6325
Correspondent:
TOKYO ELECTRON U.S. HOLDINGS, INC.
2400 GROVE BLVD.
AUSTIN, TX 78741

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