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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/17/2022
Application #:
16907183
Filing Dt:
06/20/2020
Publication #:
Pub Dt:
10/21/2021
Inventors:
Ming-Ru Chen, Tzyy-Jang Tseng, Cheng-Chung Lo
Title:
LIGHT EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
053079/0435Recorded: 06/29/2020Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/29/2020
Exec Dt:
06/12/2020
Exec Dt:
06/05/2020
Assignee:
NO. 179, SHANYING RD., GUISHAN DIST.,
TAOYUAN CITY, TAIWAN 333
Correspondent:
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN

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