Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/01/2022
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Application #:
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17028629
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Filing Dt:
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09/22/2020
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Publication #:
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Pub Dt:
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10/28/2021
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Inventors:
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Chia-Kuei Hsu, Shu-Shen Yeh, Ming-Chih Yew, Che-Chia Yang, Shin-Puu Jeng, Po-Yao Lin
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Title:
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CHIP BONDED TO A REDISTRIBUTION STRUCTURE WITH CURVED CONDUCTIVE LINES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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SLATER MATSIL, LLP |
17950 PRESTON RD., SUITE 1000 |
DALLAS, TX 75252 |
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