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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/12/2023
Application #:
17240441
Filing Dt:
04/26/2021
Publication #:
Pub Dt:
10/28/2021
Inventor:
Chiu-Lang LIN
Title:
HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE ADOPTING THE SAME
Assignment: 1
Reel/Frame:
056111/0935Recorded: 05/03/2021Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/14/2021
Assignee:
NO. 108-2, SEC. 1, GUANGFU RD., FONGSHAN DIST
KAOHSIUNG CITY, TAIWAN 83067
Correspondent:
MUNCY, GEISSLER, OLDS & LOWE, PC
4000 LEGATO RD., SUITE 310
FAIRFAX, VA 22033
Assignment: 2
Reel/Frame:
056112/0143Recorded: 05/03/2021Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/14/2021
Assignee:
NO. 108-2, SEC. 1, GUANGFU RD., FONGSHAN DIST
KAOHSIUNG CITY, TAIWAN
Correspondent:
MUNCY, GEISSLER, OLDS & LOWE, PC
4000 LEGATO RD., SUITE 310
FAIRFAX, VA 22033

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