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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/30/2021
Application #:
16864873
Filing Dt:
05/01/2020
Publication #:
Pub Dt:
11/04/2021
Inventors:
Brandon P. Wirz, Andrew M. Bayless
Title:
METHODS FOR REDUCING HEAT TRANSFER IN SEMICONDUCTOR ASSEMBLIES, AND ASSOCIATED SYSTEMS AND DEVICES
Assignment: 1
Reel/Frame:
052551/0079Recorded: 05/01/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/30/2020
Exec Dt:
04/29/2020
Assignee:
8000 S. FEDERAL WAY
P.O. BOX 6
BOISE, IDAHO 83707-0006
Correspondent:
PERKINS COIE LLP - MICRON PATENT-SEA
PO BOX 1247
SEATTLE, WA 98111-1247

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