Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/02/2024
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Application #:
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17317260
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Filing Dt:
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05/11/2021
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Publication #:
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Pub Dt:
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11/04/2021
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Inventor:
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Guoqing YU
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Title:
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SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 288, CHONGCHUAN ROAD |
| NANTONG, CHINA 226006 |
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| ANOVA LAW GROUP, PLLC |
| 21495 RIDGETOP CIRCLE, SUITE 300 |
| STERLING, VA 20166 |
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06/21/2024 03:50 PM
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