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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17375979
Filing Dt:
07/14/2021
Publication #:
Pub Dt:
11/04/2021
Inventors:
In Hwan SHIN, Sang Won SHIN, Seong Jin LEE, Jin Gyu KIM
Title:
FLEXIBLE CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR, AND PACKAGE HAVING FLEXIBLE CIRCUIT BOARD
Assignment: 1
Reel/Frame:
056857/0692Recorded: 07/14/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/09/2021
Exec Dt:
07/09/2021
Exec Dt:
07/12/2021
Exec Dt:
07/09/2021
Assignee:
79-44, GWAHAKSANEOP 4-RO, OKSAN-MYEON, HEUNGDEOK-GU
CHEONGJU-SI, CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF 28122
Correspondent:
STUDEBAKER & BRACKETT PC
8255 GREENSBORO DRIVE
SUITE 300
TYSONS, VA 22102

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