Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/03/2023
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Application #:
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16868147
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Filing Dt:
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05/06/2020
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Publication #:
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Pub Dt:
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11/11/2021
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Inventors:
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Gengming Tao, Bin Yang, Xia Li
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Title:
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III-V COMPOUND SEMICONDUCTOR DIES WITH STRESS-TREATED INACTIVE SURFACES TO AVOID PACKAGING-INDUCED FRACTURES, AND RELATED METHODS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| W&T/QUALCOMM |
| 106 PINEDALE SPRINGS WAY |
| CARY, NC 27511 |
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