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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/30/2024
Application #:
17277893
Filing Dt:
03/19/2021
Publication #:
Pub Dt:
11/11/2021
Inventors:
Mitchell Heschke, Shishuang Sun, Vijaykumar Krithivasan, Robert Yinan Cao, Mengzhi Pang
Title:
MECHANICAL ARCHITECTURE FOR A MULTI-CHIP MODULE
Assignment: 1
Reel/Frame:
055656/0372Recorded: 03/19/2021Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/20/2018
Exec Dt:
09/20/2018
Exec Dt:
09/20/2018
Exec Dt:
09/20/2018
Exec Dt:
09/20/2018
Assignee:
3500 DEER CREEK ROAD
PALO ALTO, CALIFORNIA 94304
Correspondent:
KNOBBE, MARTENS, OLSON & BEAR, LLP
2040 MAIN STREET
14TH FLOOR
IRVINE, CA 92614

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