Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/23/2022
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Application #:
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16868639
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Filing Dt:
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05/07/2020
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Publication #:
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Pub Dt:
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11/11/2021
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Inventors:
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Mitch Flowers, Erwin Cohen, Alexander Komposch
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Title:
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Integrated Circuit Having Die Attach Materials with Channels and Process of Implementing the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4600 SILICON DRIVE |
DURHAM, NORTH CAROLINA 27703 |
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BAKERHOSTETLER |
WASHINGTON SQUARE, SUITE 1100 |
1050 CONNECTICUT AVE. N.W. |
WASHINGTON, DC 20036-5304 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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4600 SILICON DRIVE |
DURHAM, NORTH CAROLINA 27703 |
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BAKERHOSTETLER |
1050 CONNECTICUT AVENUE, NW |
SUITE 1100 |
WASHINGTON, DC 20036 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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214 N. TRYON STREET, 27TH FLOOR |
MAIL CODE CN-NC-H27A |
CHARLOTTE, NORTH CAROLINA 28202 |
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NIKOLAI DOKKEDAHL |
1285 AVENUE OF THE AMERICAS |
PAUL WEISS RIFKIND WHARTON &GARRISON LLP |
NEW YORK, NY 10019-6064 |
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09/22/2024 10:41 PM
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