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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17296346
Filing Dt:
05/24/2021
Publication #:
Pub Dt:
11/18/2021
Inventors:
David H. REID JR., Peter ROACH, Shriram RADHAKRISHNAN, Aarne H. REID, Lucas PYE
Title:
ENHANCED HEAT CONDUCTION COMPONENTS
Assignment: 1
Reel/Frame:
056329/0358Recorded: 05/24/2021Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/25/2019
Exec Dt:
03/25/2019
Exec Dt:
03/25/2019
Exec Dt:
03/25/2019
Exec Dt:
03/25/2019
Assignee:
593 WASHINGTON STREET
WELLESLEY, MASSACHUSETTS 02482
Correspondent:
BAKER & HOSTETLER LLP
CIRA CENTRE 12TH FLOOR
2929 ARCH STREET
PHILADELPHIA, PA 19104-2891

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