Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/22/2022
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Application #:
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15931388
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Filing Dt:
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05/13/2020
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Publication #:
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Pub Dt:
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11/18/2021
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Inventors:
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Kelvin Tan Aik Boo, Seng Kim Ye, Hem P. Takiar, Chin Hui Chong, Hong Wan Ng
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Title:
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INTEGRATED CIRCUIT WIRE BONDED TO A MULTI-LAYER SUBSTRATE HAVING AN OPEN AREA THAT EXPOSES WIRE BOND PADS AT A SURFACE OF THE INNER LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8000 FEDERAL WAY |
BOISE, IDAHO 83716-9632 |
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PATENT DOCKET ADMINISTRATOR |
LOWENSTEIN SANDLER LLP |
ONE LOWENSTEIN DRIVE |
ROSELAND, NJ 07068 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE FOURTH NAMED INVENTOR PREVIOUSLY RECORDED AT REEL: 052654 FRAME: 0128. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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8000 FEDERAL WAY |
BOISE, IDAHO 83716-9632 |
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LOWENSTEIN SANDLER LLP / MICRON PATENT D |
ONE LOWENSTEIN DRIVE |
ROSELAND, NJ 07068 |
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05/26/2024 04:30 AM
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