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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/10/2023
Application #:
17395148
Filing Dt:
08/05/2021
Publication #:
Pub Dt:
12/02/2021
Inventors:
Guo-Huei WU, Hui-Zhong ZHUANG, Shih-Wei PENG, Wei-Cheng LIN, Jiann-Tyng TZENG
Title:
IC DEVICE MANUFACTURING METHOD
Assignment: 1
Reel/Frame:
057096/0549Recorded: 08/05/2021Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/07/2020
Exec Dt:
04/13/2020
Exec Dt:
04/15/2020
Exec Dt:
04/07/2020
Exec Dt:
04/15/2020
Assignee:
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAUPTMAN HAM, LLP (TSMC)
2318 MILL ROAD
SUITE 1400
ALEXANDRIA, VA 22314

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