Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/02/2024
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Application #:
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17126509
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Filing Dt:
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12/18/2020
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Publication #:
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Pub Dt:
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12/02/2021
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Inventors:
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Shang-Wen Chang, Yi-Hsun Chiu, Cheng-Chi Chuang, Ching-Wei Tsai, Wei-Cheng Lin et al
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Title:
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Semiconductor Devices with Backside Routing and Method of Forming Same
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6 |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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SLATER MATSIL LLP/TSMC |
17950 PRESTON ROAD, SUITE 1000 |
DALLAS, TX 75252 |
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05/28/2024 10:25 AM
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