Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/31/2023
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Application #:
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17122228
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Filing Dt:
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12/15/2020
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Publication #:
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Pub Dt:
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12/02/2021
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Inventors:
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Feng-Cheng Yang, Han-Jong Chia, Sheng-Chen Wang, Meng-Han Lin
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Title:
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NOVEL 3D RAM SL/BL CONTACT MODULATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 |
HSIN-CHU SCIENCE PARK |
HSIN-CHU, TAIWAN 300-77 |
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ESCHWEILER & POTASHNIK, LLC |
ROSETTA CENTER |
629 EUCLID AVE., SUITE 1000 |
CLEVELAND, OH 44114 |
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09/23/2024 08:03 AM
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