Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/27/2024
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Application #:
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17294615
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Filing Dt:
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05/17/2021
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Publication #:
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Pub Dt:
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12/23/2021
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Inventors:
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Rodrigo PACHER FERNANDES, Josef EHGARTNER, Manuel HOFER, Stefan Leopold HATZL et al
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Title:
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MICRO-ACOUSTIC WAFER-LEVEL PACKAGE AND METHOD OF MANUFACTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ANZINGER STR. 13 |
| MUNCHEN, GERMANY 81671 |
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| POLSINELLI |
| THREE EMBARCADERO CENTER |
| SUITE 2400 |
| SAN FRANCISCO, CA 94111 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 80 ROBINSON ROAD |
| #02-00 |
| SINGAPORE, SINGAPORE 068898 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121 |
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09/22/2024 10:41 PM
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