Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17293287
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Filing Dt:
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05/12/2021
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Publication #:
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Pub Dt:
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12/23/2021
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Inventors:
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Sung Hwan LIM, Jun Hyeok JANG, Se Yeon EOM, Yong Jin KWON
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Title:
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Method for Manufacturing Semi-Conductive Polypropylene Resin Foamed Particles and Foamed Molded Article
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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300, OLYMPIC-RO SONGPA-GU |
SEOUL, KOREA, REPUBLIC OF 05551 |
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ADDITON, PENDLETON & WITHERSPOON, P.A. |
P.O. BOX 567 |
MONROE, NC 28111 |
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09/24/2024 02:04 PM
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