Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/07/2023
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Application #:
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17286942
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Filing Dt:
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04/20/2021
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Publication #:
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Pub Dt:
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12/23/2021
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Inventors:
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Eunsoo Park, Kooknoh Yoon, Jiyoung Kim, Jeongwon Yeh
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Title:
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Complex copper alloy including high-entropy alloy and method of manufacturing same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1, GWANAK-RO, GWANAK-GU |
| SEOUL NATIONAL UNIVERSITY |
| SEOUL, KOREA, REPUBLIC OF 08826 |
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| AMANDA M. PROSE |
| 121 SOUTH EIGHTH STREET, SUITE 1100 |
| WESTMAN, CHAMPLIN & KOEHLER, P.A. |
| MINNEAPOLIS, MN 55402 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23, PYEONGHWA-RO 2862BEON-GIL |
| DONGDUCHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| AMANDA M. PROSE |
| 121 SOUTH EIGHTH STREET, SUITE 1100 |
| WESTMAN, CHAMPLIN & KOEHLER, P.A. |
| MINNEAPOLIS, MN 55402 |
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05/29/2024 09:41 PM
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