Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17287637
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Filing Dt:
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04/22/2021
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Publication #:
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Pub Dt:
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12/23/2021
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Inventors:
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Su Yun KIM, Dong Hoon OH, Yong Tae KWON, Jun Kyu LEE, Kyeong Rok SHIN, Yong Woon YEO
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Title:
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SEMICONDUCTOR PACKAGE COMPRISING FIRST MOLDING LAYER AND SECOND MOLDING LAYER WITH DIFFERENT THERMAL EXPANSION COEFFICIENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 105, GEUMIL-RO 965BEON-GIL |
| SAMSEONG-MYEON, EUMSEONG-GUN |
| CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF 27651 |
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| DANIEL H. BROADDUS |
| BRINKS GILSON & LIONE |
| P.O. BOX 10395 |
| CHICAGO, IL 60611 |
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