Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16948665
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Filing Dt:
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09/28/2020
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Publication #:
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Pub Dt:
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12/30/2021
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Inventors:
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Tetsuya YOSHIDA, Takumi HOSOYA, Hideto SHIMOYOSHI, Kazuhiro YAMAZAKI
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Title:
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WIDE BANDGAP WAFER BACKSIDE CAPPED BY A DETECTION FACILITATING LAYER
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Assignment:
1
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RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL 054523, FRAME 0378
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| 5005 EAST MCDOWELL ROAD |
| MAILDROP A700 |
| PHOENIX, ARIZONA 85008 |
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| JOANNE HADDAD/WHITE & CASE LLP |
| 1221 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10020 |
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