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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11764166
Issue Dt:
09/19/2023
Application #:
17216686
Filing Dt:
03/30/2021
Publication #:
20220005768
Pub Dt:
01/06/2022
Inventors:
Hsin-Cheng Lai, Tai-Jui Wang, Tzu-Yang Ting, Jui-Wen Yang, Chieh-Wei Feng, Yu-Hua Chung
Title:
SEMICONDUCTOR PACKAGE STRUCTURE
Assignment: 1
Reel/Frame:
055843/0738Recorded: 04/06/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
YANG, JUI-WEN
Exec Dt:
08/21/2020
LAI, HSIN-CHENG
Exec Dt:
08/21/2020
FENG, CHIEH-WEI
Exec Dt:
08/21/2020
WANG, TAI-JUI
Exec Dt:
08/21/2020
CHUNG, YU-HUA
Exec Dt:
08/21/2020
TING, TZU-YANG
Exec Dt:
08/21/2020
Assignee:
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
195, SEC. 4, CHUNG HSING RD., CHUTUNG,
HSINCHU, TAIWAN 310401
Correspondent:
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN
Assignment: 2
Reel/Frame:
062118/0863Recorded: 12/16/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Exec Dt:
10/25/2022
Assignees:
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
195, SEC. 4, CHUNG HSING RD., CHUTUNG,
HSINCHU, TAIWAN 310401
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 300-78
Correspondent:
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN

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