Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/17/2023
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Application #:
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16984601
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Filing Dt:
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08/04/2020
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Publication #:
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Pub Dt:
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01/06/2022
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Inventors:
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Hui-Ling Chen, Chun-Ting Yeh, Chien En Hsu, Zhirui Sheng, Chung-Hsing Kuo, Ming-Tse Lin
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Title:
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STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD FOR BONDING TWO SUBSTRATES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| J C PATENTS |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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