Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/23/2023
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Application #:
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17069179
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Filing Dt:
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10/13/2020
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Publication #:
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Pub Dt:
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01/20/2022
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Inventor:
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Chung Hyun LEE
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Title:
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WAFER AND METHOD FOR ANALYZING SHAPE THEREOF
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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53 IMSU-RO, GUMI-SI |
GYEONGSANGBUK-DO, KOREA, REPUBLIC OF 39386 |
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KED & ASSOCIATES, LLP |
P.O. BOX 8638 |
RESTON, VA 20195 |
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09/23/2024 04:04 AM
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