Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/25/2024
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Application #:
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17488503
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Filing Dt:
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09/29/2021
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Publication #:
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Pub Dt:
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01/20/2022
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Inventors:
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Hsingya Arthur WANG, Sheng-Yuan CHOU, Yu-Ting WANG, Wan-Yi CHANG
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Title:
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WAFER-BONDING STRUCTURE AND METHOD OF FORMING THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1623 BUCKEYE DR. |
| MILPITAS, CALIFORNIA 95035 |
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| MCCLURE, QUALEY & RODACK, LLP |
| 280 INTERSTATE NORTH CIRCLE |
| SUITE 550 |
| ATLANTA, GA 30339 |
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09/22/2024 07:57 AM
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