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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	11855185	Issue Dt:	12/26/2023	Application #:	17198133	Filing Dt:	03/10/2021
Publication #:	20220020865	Pub Dt:	01/20/2022
Inventors:	Wen-Ju Chen, Chung-Ting Ko, Ya-Lan Chang, Ting-Gang Chen, Tai-Chun Huang, Chi On Chui
Title:	Multilayer Masking Layer and Method of Forming Same

Assignment: 1

Reel/Frame:

055886/0731

Recorded: 04/09/2021

Pages: 6

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

CHEN, WEN-JU

Exec Dt:

03/30/2021

KO, CHUNG-TING

Exec Dt:

11/03/2020

CHANG, YA-LAN

Exec Dt:

11/03/2020

CHEN, TING-GANG

Exec Dt:

11/03/2020

HUANG, TAI-CHUN

Exec Dt:

11/03/2020

CHUI, CHI ON

Exec Dt:

11/03/2020

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

8, LI-HSIN RD. 6

HSINCHU SCIENCE PARK

HSINCHU, TAIWAN 300-78

Correspondent:

SLATER MATSIL, LLP/TSMC

17950 PRESTON ROAD, SUITE 1000

DALLAS, TX 75252

Assignment: 2

Reel/Frame:

055909/0626

Recorded: 04/13/2021

Pages: 7

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE TYPOGRAPHICAL ERROR IN THE FIFTH ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL: 055886 FRAME: 0731. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.

Assignors:

CHEN, WEN-JU

Exec Dt:

03/30/2021