Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/31/2023
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Application #:
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17496756
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Filing Dt:
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10/07/2021
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Publication #:
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Pub Dt:
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01/27/2022
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Inventors:
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Hisao ISHIKAWA, Akira OGIHARA, Masao KAYABA
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Title:
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METHOD FOR MANUFACTURING SOLDER PRODUCT, SOLDER, SOLDERED COMPONENT, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, WIRE, SOLDERED PRODUCT, FLEXIBLE PRINTED BOARD, ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING TIN ARTICLE, METHOD FOR MANUFACTURING TIN INTERMEDIATE PRODUCT, TIN INTERMEDIATE PRODUCT, AND CONDUCTIVE MEMBER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 475-2, TSURUTA, MOOKA-SHI, |
| TOCHIGI, JAPAN 3214302 |
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| 4-15-4, CHUO, WARABI-SHI, |
| SAITAMA, JAPAN 3350004 |
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| 6-11-10, MORI, ISOGO-KU, YOKOHAMA-SHI, |
| KANAGAWA, JAPAN 2350023 |
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| JCIP GLOBAL INC. |
| 20 PACIFICA, SUITE 220 |
| IRVINE, CA 92618 |
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