Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/01/2022
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Application #:
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16941509
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Filing Dt:
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07/28/2020
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Publication #:
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Pub Dt:
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02/03/2022
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Inventors:
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Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu, Chih-Chien Pan
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Title:
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AN ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVERED BY A LID
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
HSINCHU, TAIWAN 30078 |
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JCIPRNET |
8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
TAIPEI, 100404 TAIWAN |
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05/28/2024 09:23 AM
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