Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/05/2023
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Application #:
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17451012
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Filing Dt:
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10/15/2021
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Publication #:
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Pub Dt:
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02/03/2022
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Inventors:
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Gerald Weidinger, Andreas Zluc
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Title:
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Component With Dielectric Layer for Embedding in Component Carrier
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| FABRIKSGASSE 13 |
| LEOBEN, AUSTRIA 8700 |
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| SMITH TEMPEL BLAHA LLC DOCKETING DEPARTM |
| 1600 PARKWOOD CIRCLE SE, SUITE 620 |
| ATLANTA, GA 30339 |
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