Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/14/2022
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Application #:
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17096190
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Filing Dt:
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11/12/2020
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Publication #:
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Pub Dt:
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02/03/2022
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Inventors:
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Chih-Yen SU, Chun-Te LIN
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Title:
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BUMP STRUCTURE OF THE SEMICONDUCTOR PACKAGE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.10, DATONG RD. |
HUKOU TOWNSHIP, HSINCHU COUNTY, TAIWAN 30352 |
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PATENTTM.US JAMES H. WALTERS |
205 SE SPOKANE ST STE 300 |
PORTLAND, OR 97202-6487 |
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05/28/2024 02:44 AM
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