Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
09/12/2023
|
Application #:
|
17507112
|
Filing Dt:
|
10/21/2021
|
|
Publication #:
|
|
Pub Dt:
|
02/10/2022
| | | | |
|
Inventors:
|
Sung-Yi Yang, Pao-Chuan Wang
|
|
Title:
|
SUBSTRATE ASSEMBLY AND METHOD OF BONDING SUBSTRATES
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 256, SEC. 1, SHENLIN RD., DAYA DIST. |
| TAICHUNG CITY, TAIWAN 42865 |
|
|
|
|
| YOUNG BASILE HANLON & MACFARLANE, P.C. |
| 3001 WEST BIG BEAVER RD. |
| SUITE 624 |
| TROY, MI 48084 |
|
|
Search Results as of:
09/22/2024 06:15 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
