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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11742282
Issue Dt:
08/29/2023
Application #:
16988422
Filing Dt:
08/07/2020
Publication #:
20220044999
Pub Dt:
02/10/2022
Inventors:
Jordan D. Greenlee, Rita J. Klein, Everett A. McTeer, John D. Hopkins, Shuangqiang Luo et al
Title:
Conductive Interconnects
Assignment: 1
Reel/Frame:
053437/0409Recorded: 08/07/2020Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
GREENLEE, JORDAN D.
Exec Dt:
08/06/2020
KLEIN, RITA J.
Exec Dt:
08/06/2020
MCTEER, EVERETT A.
Exec Dt:
08/07/2020
HOPKINS, JOHN D.
Exec Dt:
07/27/2020
LUO, SHUANGQIANG
Exec Dt:
08/03/2020
TAN, SONG KAI
Exec Dt:
08/06/2020
FONG, JING WAI
Exec Dt:
07/28/2020
JINDAL, ANURAG
Exec Dt:
08/04/2020
QUEK, CHIEH HSIEN
Exec Dt:
07/29/2020
Assignee:
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MS 1- 525
BOISE, IDAHO 83716
Correspondent:
WELLS ST. JOHN P.S.
601 W. MAIN AVENUE
SUITE 600
SPOKANE, 99201 UNITED STATES

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