Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/22/2022
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Application #:
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16994711
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Filing Dt:
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08/17/2020
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Publication #:
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Pub Dt:
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02/17/2022
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Inventors:
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Tsung-Yen LEE, Chin-Hua WANG, Ming-Chih YEW, Chia-Kuei HSU, Po-Chen LAI, Po-Yao LIN et al
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Title:
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ORGANIC INTERPOSER INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND METHODS OF FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN 6 ROAD |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN ROC 30077 |
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THE MARBURY LAW GROUP, PLLC |
11800 SUNRISE VALLEY DRIVE |
15TH FLOOR |
RESTON, VA 20191 |
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09/21/2024 07:43 PM
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