Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/06/2024
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Application #:
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17274814
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Filing Dt:
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03/10/2021
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Publication #:
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Pub Dt:
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02/17/2022
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Inventors:
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Keith K. Sturcken, Kenneth J. Cross, Michael J. O'Connor
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Title:
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HERMETICALLY SEALED ELECTRONICS MODULE WITH ENHANCED COOLING OF CORE INTEGRATED CIRCUIT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| PO BOX 868 |
| NHQ1-719 |
| NASHUA, NEW HAMPSHIRE 03061-0868 |
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| NANCY YOUNG |
| 65 SPIT BROOK ROAD |
| NHQ01-719 |
| NASHUA, NH 03060 |
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06/28/2024 02:42 PM
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