Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
07/02/2024
|
Application #:
|
17413560
|
Filing Dt:
|
06/13/2021
|
Publication #:
|
|
Pub Dt:
|
02/17/2022
| | | | |
Inventors:
|
Yong Won CHA, Mi Ok CHO, Ji Soo CHO, Dae Hyeon KIM
|
Title:
|
SUBSTRATE BONDING APPARATUS
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
2F, 15-23, DONGTANSANDAN 6-GIL |
HWASEONG-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 18487 |
|
|
|
MASCHOFF BRENNAN |
1389 CENTER DRIVE, SUITE 300 |
PARK CITY, UT 84098 |
|
|
Search Results as of:
09/24/2024 08:54 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|