Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/06/2022
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Application #:
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17149498
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Filing Dt:
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01/14/2021
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Publication #:
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Pub Dt:
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02/17/2022
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Inventors:
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Kun FANG, Suhyung HWANG, Boyu TSENG, Jaehyun YEON, Hyunchul CHO
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Title:
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PACKAGE WITH SUBSTRATE COMPRISING VARIABLE THICKNESS SOLDER RESIST LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121-1714 |
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| LOZA & LOZA LLP |
| 305 NORTH SECOND AVE., #127 |
| UPLAND, CA 91786-6064 |
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