Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17398672
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Filing Dt:
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08/10/2021
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Publication #:
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Pub Dt:
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02/17/2022
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Inventors:
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Tak Chuen Or, Cheng Chen Nieh, Chiu Keung Loong, Ming Hong Daniel Wong
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Title:
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COOLING SYSTEM FOR COOLING AN ELECTRONICS COMPONENT OF AN ELECTRICAL DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5/F, CHAI WAN INDUSTRIAL CENTRE |
| 20 LEE CHUNG STREET |
| CHAI WAN, HONG KONG |
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| WILLIAM T. HOYER MCCARTHY |
| HAYNES AND BOONE LLP |
| 2323 VICTORY AVENUE, SUITE 700 |
| DALLAS, TX 75219 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5/F, CHAI WAN INDUSTRIAL CENTRE |
| 20 LEE CHUNG STREET |
| CHAI WAN, HONG KONG |
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| HONGMEI SECOND INDUSTRIAL AREA |
| HONGMEI TOWN, DONGGUAN |
| GUANGDONG, CHINA 523160 |
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| WILLIAM T. HOYER MCCARTHY |
| HAYNES AND BOONE LLP |
| 2323 VICTORY AVENUE, SUITE 700 |
| DALLAS, TX 75219 |
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