Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
10/10/2023
|
Application #:
|
17367100
|
Filing Dt:
|
07/02/2021
|
|
Publication #:
|
|
Pub Dt:
|
02/24/2022
| | | | |
|
Inventors:
|
Sang Jun PARK, Jun Hyuck KWON, Tian Hao HAN, Kwang Seon JIN, Byung Chul CHO, Jong Ki AN
|
|
Title:
|
METHOD AND APPARATUS FOR ATOMIC LAYER ETCHING
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 75, JINWISANDAN-RO, JINWI-MYEON |
| PYEONGTAEK-SI GYEONGGI-DO, KOREA, REPUBLIC OF 17709 |
|
|
|
|
| WILLIAM PARK & ASSOCIATES LTD. |
| 930 N. YORK ROAD, SUITE 201 |
| HINSDALE, IL 60521 |
|
|
Search Results as of:
06/16/2024 01:56 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
