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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17000701
Filing Dt:
08/24/2020
Publication #:
Pub Dt:
02/24/2022
Inventors:
Che-Fu CHIU, Huicheng CHANG, Sih-Jie LIU, Bau-Ming WANG, Chun-Feng NIEH, Yee-Chia YEO
Title:
METHOD AND DEVICE TO REDUCE EPITAXIAL DEFECTS DUE TO CONTACT STRESS UPON A SEMICONDCUTOR WAFER
Assignment: 1
Reel/Frame:
060528/0634Recorded: 07/18/2022Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/11/2022
Exec Dt:
06/26/2022
Exec Dt:
03/16/2022
Exec Dt:
04/18/2022
Exec Dt:
03/06/2022
Exec Dt:
03/10/2022
Assignee:
NO. 8, LI-HSIN 6 ROAD
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN ROC 30077
Correspondent:
THE MARBURY LAW GROUP, PLLC
11800 SUNRISE VALLEY DRIVE
15TH FLOOR
RESTON, VA 20191

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