Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17415167
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Filing Dt:
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06/17/2021
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Publication #:
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Pub Dt:
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02/24/2022
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Inventors:
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Thomas BODNER, Bernhard LOEFFLER, Joerg SIEGERT
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Title:
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SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCHLOSS PREMSTÄTTEN |
| TOBELBADER STR. 30 |
| PREMSTÄTTEN, AUSTRIA 8141 |
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| MH2 TECHNOLOGY LAW GROUP, LLP |
| 1951 KIDWELL DRIVE |
| SUITE 310 |
| TYSONS CORNER, VA 22182 |
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