Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/04/2024
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Application #:
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17411166
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Filing Dt:
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08/25/2021
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Publication #:
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Pub Dt:
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03/03/2022
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Inventors:
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Ryota Okamoto, Keita Mizuma
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Title:
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RESIN MOLDING APPARATUS AND METHOD FOR PRODUCING RESIN MOLDED PRODUCT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5, KAMICHOSHI-CHO, KAMITOBA, MINAMI-KU, KYOTO-SHI |
KYOTO, JAPAN 6018105 |
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DILWORTH & BARRESE, LLP |
1000 WOODBURY ROAD |
WOODBURY, NY 11797 |
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09/23/2024 02:41 AM
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