Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/07/2023
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Application #:
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17221137
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Filing Dt:
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04/02/2021
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Publication #:
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Pub Dt:
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03/10/2022
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Inventors:
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Jun Tae Han, Sun Ho Yoon, Jeong Ryeol Kim, Myung Hwa You, Young Joon Oh, Seul A Park
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Title:
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MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY NAMES AND ASSIGNEE PREVIOUSLY RECORDED AT REEL: 055817 FRAME: 0617. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT .
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| MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| MORGAN LEWIS & BOCKIUS LLP |
| 1111 PENNSYLVANIA AVENUE NW |
| WASHINGTON, DC 20004 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| (GOEDONG-DONG) 6261, DONGHAEAN-RO, NAM-GU |
| POHANG-SI, GYEONGSANGBUK-DO, KOREA, REPUBLIC OF 37859 |
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| MORGAN LEWIS & BOCKIUS LLP |
| 1111 PENNSYLVANIA AVENUE NW |
| WASHINGTON, DC 20004 |
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