Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/18/2024
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Application #:
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17083271
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Filing Dt:
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10/28/2020
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Publication #:
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Pub Dt:
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03/17/2022
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Inventors:
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Ming-Hao WU, Hsuan-Wei CHEN
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Title:
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CIRCUIT BOARD WITH A CONDUCTIVE BUMP MOUNTED ON AN ADHESIVE LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.38, XINGBANG RD., GUISHAN IND. PARK |
| TAOYUAN, TAIWAN 330 |
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| CKC & PARTNERS CO., LLC |
| 12345 LAKE CITY WAY NE, NO. 283 |
| SEATTLE, WA 98125 |
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