Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17425175
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Filing Dt:
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07/22/2021
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Publication #:
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Pub Dt:
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03/24/2022
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Inventors:
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Susana Amorim Lopes, Vivian Van der Burgt, Betty Baelus et al
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Title:
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Electrospun Cover Layer for Medical Implants
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 80 |
| EINDHOVEN, NETHERLANDS 5600AB |
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| RON JACOBS |
| 438 CAMBRIDGE AVE. |
| SUITE 225 |
| PALO ALTO, CA 94306 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SEEFELDSTRASSE 69 |
| ZURICH, SWITZERLAND CH-8008 |
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| RON JACOBS |
| 438 CAMBRIDGE AVE. |
| SUITE 225 |
| PALO ALTO, CA 94306 |
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