Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/18/2023
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Application #:
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17540224
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Filing Dt:
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12/01/2021
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Publication #:
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Pub Dt:
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03/24/2022
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Inventors:
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Weihua Cheng, Jun Liu
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Title:
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BONDED UNIFIED SEMICONDUCTOR CHIPS AND FABRICATION AND OPERATION METHODS THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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18 GAOXIN 4TH ROAD |
ECONOMIC & TECHNOLOGICAL DEVELOPMENT ZONE |
WUHAN, HUBEI, CHINA |
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BAYES PLLC |
8260 GREENSBORO DRIVE |
SUITE 625 |
MCLEAN, 22102 UNITED STATES |
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09/23/2024 11:03 PM
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